SEMI中国和福州物联网开放实验室在开幕主题演讲上签署“IoT标准制定战略合作框架协议”

开幕主题演讲
日期:  2018年3月14日  星期三
时间: 12:30-16:45
地点:  上海浦东嘉里大酒店，上海厅1

现场提供中英文同声传译

开幕主题演讲汇集全球顶级行业领袖，是SEMICON China 这一全球最大规模半导体年度盛会中不容错过的内容，是了解全球产业格局、前沿技术与市场走势，分享全球业界领袖智慧和视野，并与他们面对面交流的难得机会。

12:30 – 13:00

Registration 来宾登记
Meet & Greet 贵宾会晤

13:00 – 13:30

Opening Remark 开幕致辞

Lung Chu
President, SEMI China; Vice President, SEMI
居龙，SEMI全球副总裁、中国区总裁

Ajit Manocha
President & CEO, SEMI
Ajit Manocha，SEMI总裁兼首席执行官

Wang Ning
President, CECC
王宁，中国电子商会会长

Moderator Introduces Speakers 主持人介绍演讲嘉宾

Erzhuang Liu
Vice President, General Manager of Lam Research China Operations
刘二壮，泛林集团副总裁兼中国区总经理

13:30 – 16:30
Keynote Speech 主题演讲

13:35–14:00

Zhou Zixue
Chairman, CSIA
Chairman of the Board, SMIC
周子学，

中国半导体行业协会理事长，中芯国际董事长

14:00–14:25

Rick Wallace
CEO and President

KLA-Tencor Corporation

14:25–14:50

Walden C. Rhines
President & Chief Executive Officer

Mentor, a Siemens Business

14:50–15:15

Stephen D. Kelley
President and Chief Executive Officer
Amkor

15:15–15:40

Robert E. Bruck
General Manager, Global Supply Management Organization, Intel
Vice President,Intel

15:40–16:05

Rick Gottscho
Executive Vice President & Corporate Chief Technology Officer, Lam Research

16:05–16:30

Closing Keynote

Chu Qing
Vice President & Chief Strategy Officer

Huawei
楚庆，华为副总裁兼首席战略官

16:30–16:40

SEMI中国&福州物联网开放实验室“IoT标准制定战略合作框架协议”签署仪式

16:40 – 16:45

Thank you 致谢结束

*Agenda is subject to change

议程变化恕不另行通知

SEMI China
Tel：+86.21.6027.8500
Fax：+86.21.6027.8511
E-mail：semichina@semi.org